OPTICAL SPECIFICATIONS

 

Camera:

• Cooled InGaAs (900-1700nm)

• Silicon-based option for NIR applications, (740nm-1100nm) Illumination:

• Epi, optimized Koehler

• Transmitted, optimized sub-stage Filters:

• Multi position filter slider sets available based on application

 

Aperture/Field Diaphragms:

• Manual adjust

 

Magnification:

• 10x-1000x

 

Objectives:

• 1x-100x, (1x, 2.5x, 5x, 10x, 20x, 50x, 100x). Greater than 100x objectives are available based on the application

 

Turret:

• Manual, optional motorized Resolution:

• Submicron optical and digital

 

Display:

• Large monitor for live and stored image display

PLATFORM SPECIFICATIONS

 

Stand:

• 8” Microscope stand with coarse/fine Z focus control

 

Stage:

• 8” x 8” Stage with coarse/fine manual position control. Other stage sizes available upon request.

• Optional motorized stage with joystick control available

 

PROCESS

 

In Process:

• Verification of critical alignment applications such as: MEMS, wafer bonding, 3D chip stacking, crack/chip inspection metrology.

 

Post Process:

• Verification, validation, inspection and measurement of critical sub-surface features

 

Failure Analysis:

• Process development tool verification, part characterization, qualification and environmental testing.

Download PDF Specification Sheet >>